Thermal Interface Materials
Graphite Bond Copper
Our Graphite Bond Copper (LST-GBC) series is perfect for the smallest of design allowances whereby the gap available is extremely small (0.01-0.1mm), and an intricate thermal material design is required. With an extremely high thermal conductivity ranging from 700-1,750 w/mk, this member of our Graphite Thermal Material family of products is made using high crystallized graphite material bonded with copper. This allows for bendability and more intricate design requirements as the bonded copper gives the graphite material a very sturdy yet flexible quality.
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| Part Number | Description | Thickness (mm) | Thermal Conductivity (W/m-K) | |
| Z | X-Y | |||
| LST-GBC-010-CU | Graphite Bond Copper | 0.029 | 10 | 1750 |
| LST-GBC-017-CU | Graphite Bond Copper | 0.036 | 11 | 1750 |
| LST-GBC-025-CU | Graphite Bond Copper | 0.044 | 18 | 1500 |
| LST-GBC-040-CU | Graphite Bond Copper | 0.059 | 20 | 1350 |
| LST-GBC-050-CU | Graphite Bond Copper | 0.069 | 20 | 1300 |
| LST-GBC-070-CU | Graphite Bond Copper | 0.089 | 20 | 1000 |
| LST-GBC-100-CU | Graphite Bond Copper | 0.119 | 26 | 700 |