Thermal Interface Materials

Graphite Bond Copper

Our Graphite Bond Copper (LST-GBC) series is perfect for the smallest of design allowances whereby the gap available is extremely small (0.01-0.1mm), and an intricate thermal material design is required. With an extremely high thermal conductivity ranging from 700-1,750 w/mk, this member of our Graphite Thermal Material family of products is made using high crystallized graphite material bonded with copper. This allows for bendability and more intricate design requirements as the bonded copper gives the graphite material a very sturdy yet flexible quality.

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** Click on Part Number to view and download datasheet.

** Please


and click on Part Number to view and download datasheet.

Part NumberDescriptionThickness (mm)Thermal Conductivity (W/m-K)
LST-GBC-010-CUGraphite Bond Copper0.029101750
LST-GBC-017-CUGraphite Bond Copper0.036111750
LST-GBC-025-CUGraphite Bond Copper0.044181500
LST-GBC-040-CUGraphite Bond Copper0.059201350
LST-GBC-050-CUGraphite Bond Copper0.069201300
LST-GBC-070-CUGraphite Bond Copper0.089201000
LST-GBC-100-CUGraphite Bond Copper0.11926700
Note: The thickness of our Graphite Bond Copper material can be custom made to your particular requirement